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|
Item |
Specification |
1 |
Type of Assembly |
SMT Assembly (Surface-mounting technology) |
|
|
Thru-hole Asse mbly (Through-hole soldering Technology) |
2 |
Solder Type |
Water soluble solder paste, lead free |
3 |
Component |
Component sourcing service |
4 |
Min. IC Pitch |
0.30mm |
5 |
Foot Pin |
SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
6 |
Min. Chip Placement |
1005 |
7 |
Max. PCB Size |
600mm*400mm |
8 |
Min. PCB Thickness |
0.35mm |
9 |
Max. BGA Size |
74mm*74mm |
10 |
Max. Ball Pitch |
1mm-3mm |
11 |
Max. Ball Diameter |
0.4mm-1mm |
12 |
QFP Lead Pitch |
0.38mm-2.54mm |
13 |
Package |
Inner package: anti-static bubble Bag |
|
|
Outer Package: carton box |
14 |
Certificate |
PCB Assembly with UL, RoHS approval |